Outsourced Semiconductor Assembly and Test Services Market Synopsis

Outsourced Semiconductor Assembly and Test Services Market Size Was Valued at USD 40.20 Billion in 2023 and is Projected to Reach USD 85.24 Billion by 2032, Growing at a CAGR of 8.71% From 2024-2032.

Outsourced Semiconductor Assembly and Test Services (OSAT) are companies that specialize in providing assembly and testing services to integrated device manufacturers, fabless semiconductor companies, and foundries.

• Outsourced Semiconductor Assembly and Test Services (OSAT) offer multiple advantages to semiconductor companies by enhancing efficiency and competitiveness.
• Cost savings are accomplished by taking advantage of economies of scale and by not investing in facilities and equipment. Continuous improvement and innovative processes contribute to increased operational efficiency. Rapid scalability and diversification of products enhance flexibility.
• Expertise and technology, combined with continuous improvement measures, guarantee quality assurance. Shorter lead times and agility lead to achieving a quicker time to market. Optimizing the supply chain and keeping up with market trends enhance risk management.
• Companies can stimulate growth by concentrating on their key strengths and being innovative. OSAT companies' worldwide presence allows for market expansion and access to specialized local knowledge.

Outsourced Semiconductor Assembly and Test Services Market Trend Analysis

High Demand for Automotive and Consumer Electronics Wherein Semiconductors Are Highly Used

• The demand for semiconductors in automotive and consumer electronics sectors is driving rapid growth in the OSAT market. The move towards electric cars and autonomous driving in the automotive sector is increasing the demand for sophisticated semiconductor parts for various automotive functions like power electronics, safety systems, and vehicle communication.
• The increasing popularity of smart devices and IoT technologies in the consumer electronics market is driving the need for small, powerful semiconductors. OSAT companies are crucial in supplying advanced packaging solutions and testing services to satisfy industry needs.
• Manufacturers can achieve cost efficiency and supply chain flexibility by outsourcing assembly and testing services to OSAT providers. Furthermore, OSAT providers assist in meeting environmental and safety regulations, which enhances market growth and success.

Restraint

Higher Capital Requirements for Providing Advanced Packaging Solutions

• Increased capital requirements for offering advanced packaging solutions hinder the expansion of the Outsourced Semiconductor Assembly and Test Services (OSAT) market.
• The reason for this is the high cost involved in creating and putting into action new packaging technologies, which includes expenses for research and development and the requirement for specific equipment like wafer-level packaging and 3D packaging machines.
• Investing money up front is necessary for improving facilities and implementing automation, which can result in the risk of becoming outdated technologically and needing frequent upgrades. Small players might find it difficult to join the market because of obstacles to entry, resulting in market consolidation.
• The extended repayment periods and the unpredictable market in the semiconductor sector may create obstacles when trying to gain a profit from advanced packaging solutions. In general, the significant capital requirements create challenges for businesses in the OSAT market, affecting competition and the range of services available.

Opportunity

Growing Disposable Income of Customers and Growing Middle-Class Population Along with The Continuous Fall in The Prices of Electronics

• The OSAT market is presented with attractive opportunities due to the rise in disposable income, increase in the middle-class demographic, and decreasing electronics prices.
•  Consumers with more money to spend are able to purchase electronics, which in turn boosts the need for semiconductors and OSAT services. The rise of the middle class, especially in developing economies, brings about fresh prospects for electronics producers and OSAT providers, as a range of product needs leads to a demand for different semiconductors.
• The decrease in electronic prices allows a larger group of people to afford products, leading to higher sales and a greater need for semiconductors. These changes also result in market trends that support the importance of being agile, flexible, and utilizing technology advancements in the OSAT industry, enabling creativity and cost-efficient production processes.
• Consequently, the OSAT market is poised to gain a lot from these economic trends, solidifying its status as a crucial contributor to the growth and advancement of the semiconductor industry.

Outsourced Semiconductor Assembly and Test Services Market Segment Analysis:

The Outsourced Semiconductor Assembly and Test Services market is segmented on the basis of Service Type, Packaging Type, and Application.

By Packaging Type, Ball Grid Array Segment Is Expected to Dominate the Market During the Forecast Period

There are five segments by packaging type such as ball grid array, chip scale packaging (CSP), multi-chip packaging (MCP), stacked die packaging, and quad & dual packaging. Among these, the ball grid array segment is expected to dominate the market during the forecast period.

• Ball grid array packaging is poised to take over the OSAT market for numerous reasons. Initially, Ball grid arrays provide increased capability and density, offering improved connectivity and a smaller footprint for contemporary gadgets. In addition, Ball grid arrays display excellent thermal efficiency and dependability, providing efficient cooling and lower rates of malfunction.
• Ball grid array packaging is adaptable, able to grow in size, and can serve various purposes, addressing a broad spectrum of uses and adapting to changing industry demands. Moreover, Ball grid arrays provide cost savings and efficiency through decreased production expenses and simplified PCB design.
• With the electronics sector requiring smaller, quicker, and more potent gadgets, Ball grid arrays are ideal for backing up cutting-edge features and advancements in technology. Additionally, they offer simplified integration and compatibility, ensuring longevity for intricate multi-chip modules and system-in-package designs.
• The superior efficiency and small footprint of Ball grid arrays make them a top pick for advanced uses, guaranteeing that devices stay up-to-date in a rapidly changing market.

By Application, Consumer Electronics Segment Held the Largest Share In 2023

There are six segments by application such as automotive, communication, consumer electronics, computing & networking, industrial, and aerospace & defense. Among these, the consumer electronics segment held the largest share in 2023.

• The consumer electronics sector has a strong presence in the Outsourced Semiconductor Assembly and Test Services (OSAT) market due to fast technological progress and the need for innovation in products like smartphones and wearables.
• Mass production of consumer electronics requires efficient assembly and testing, which OSAT services can provide. Specific testing and assembly methods are necessary for intricate chips in these devices, further driving demand for OSAT providers.
• The global reach of consumer electronics and IoT devices has also increased the need for OSAT services. Economies of scale reduce costs for OSAT services, allowing for quick assembly and testing cycles to meet short product life cycles. Outsourcing ensures product dependability and safety while also enabling companies to respond quickly to market trends.

Outsourced Semiconductor Assembly and Test Services Market Regional Insights:

Asia Pacific is Expected to Dominate the Market Over the Forecast Period

• The reason for Asia Pacific's dominance in the Outsourced Semiconductor Assembly and Test Services (OSAT) market is its robust semiconductor industry ecosystem, cost-effectiveness, advanced manufacturing abilities, strategic positioning, skilled labour force, government backing, swift industry expansion, and connection to worldwide supply chains.
• The area has many semiconductor manufacturers, design houses, and electronic equipment manufacturers, leading to a strong need for OSAT services. Decreased labour expenses in Asia Pacific enable efficient high-volume assembly and testing procedures.
• Cutting-edge facilities with the most up-to-date technology guarantee high quality and productivity. Efficient supply chains are made easier by having access to key markets in Asia, the Americas, and Europe. A proficient workforce with training in semiconductor technologies and processes is necessary for precise work in OSAT.
• Investments by the government in infrastructure and incentives serve to draw semiconductor and electronics manufacturing. The increase in new competitors in the sector is also boosting the need for outsourcing services.

Outsourced Semiconductor Assembly and Test Services Market Active Players

• ASE Technology Holding Co. Ltd. (China)
• Amkor Technology (United States)
• Walton Advanced Engineering Inc. (China)
• STATS ChipPAC (Singapore)
• Unisem Group (Malaysia)
• Siliconware Precision Industries (SPIL) (China)
• Powertech Technology Inc. (China)
• TongFu Microelectronics Co. Ltd. (China)
• Tianshui Huatian Technology Co. Ltd (China)
• UTAC Holdings Ltd (Singapore)
• Nantong Fujitsu Microele (China)
• King Yuan Electronics CO. (China)
• ChipMOS Technologies Inc. (China)
• Hana Micron (South Korea)
• ASE Group (Taiwan)
• Powertech Technology Inc. (Taiwan)
• ChipMOS Technologies (Taiwan)
• Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
• Chipbond Technology Corporation (Taiwan)
• Global Foundries Inc. (United States)
• CORWIL Technology Corp. (Israel)
• Thinklogical (Belden Inc.) (United States)
• Tripp Lite (United States)
• HIDENSITY GROUP (Switzerland)
• SIFIVE, INC. (United States), and Other Active Players.

1. INTRODUCTION
   1. RESEARCH OBJECTIVES
   2. RESEARCH METHODOLOGY
   3. RESEARCH PROCESS
   4. SCOPE AND COVERAGE
      1. Market Definition
      2. Key Questions Answered
   5. MARKET SEGMENTATION
2. EXECUTIVE SUMMARY
3. MARKET OVERVIEW
4. GROWTH OPPORTUNITIES BY SEGMENT
5. MARKET LANDSCAPE
   1. PORTER’S FIVE FORCES ANALYSIS
      1. Bargaining Power of Supplier
      2. Threat Of New Entrants
      3. Threat Of Substitutes
      4. Competitive Rivalry
      5. Bargaining Power Among Buyers
   2. INDUSTRY VALUE CHAIN ANALYSIS
   3. MARKET DYNAMICS
      1. Drivers
      2. Restraints
      3. Opportunities
      4. Challenges
   4. MARKET TREND ANALYSIS
   5. REGULATORY LANDSCAPE
   6. PESTLE ANALYSIS
   7. PRICE TREND ANALYSIS
   8. PATENT ANALYSIS
   9. TECHNOLOGY EVALUATION
   10. MARKET IMPACT OF THE RUSSIA-UKRAINE WAR
       1. Geopolitical Market Disruptions
       2. Supply Chain Disruptions
       3. Instability in Emerging Markets
   11. ECOSYSTEM
6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY SERVICE TYPE (2017-2032)
   1. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET SNAPSHOT AND GROWTH ENGINE
   2. MARKET OVERVIEW
   3. PACKAGING
      1. Introduction And Market Overview
      2. Historic And Forecasted Market Size in Value (2017-2032F)
      3. Historic And Forecasted Market Size in Volume (2017-2032F)
      4. Key Market Trends, Growth Factors and Opportunities
      5. Geographic Segmentation Analysis
   4. TESTING
7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY PACKAGING TYPE (2017-2032)
   1. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET SNAPSHOT AND GROWTH ENGINE
   2. MARKET OVERVIEW
   3. BALL GRID ARRAY
      1. Introduction And Market Overview
      2. Historic And Forecasted Market Size in Value (2017-2032F)
      3. Historic And Forecasted Market Size in Volume (2017-2032F)
      4. Key Market Trends, Growth Factors And Opportunities
      5. Geographic Segmentation Analysis
   4. CHIP SCALE PACKAGING (CSP)
   5. MULTI-CHIP PACKAGING (MCP)
   6. STACKED DIE PACKAGING
   7. QUAD & DUAL PACKAGING
8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY APPLICATION (2017-2032)
   1. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET SNAPSHOT AND GROWTH ENGINE
   2. MARKET OVERVIEW
   3. AUTOMOTIVE
      1. Introduction And Market Overview
      2. Historic And Forecasted Market Size in Value (2017-2032F)
      3. Historic And Forecasted Market Size in Volume (2017-2032F)
      4. Key Market Trends, Growth Factors And Opportunities
      5. Geographic Segmentation Analysis
   4. COMMUNICATION
   5. CONSUMER ELECTRONICS
   6. COMPUTING & NETWORKING
   7. INDUSTRIAL
   8. AEROSPACE & DEFENSE
9. COMPANY PROFILES AND COMPETITIVE ANALYSIS
   1. COMPETITIVE LANDSCAPE
      1. Competitive Benchmarking
      2. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES Market Share By Manufacturer (2023)
      3. Industry BCG Matrix
      4. Heat Map Analysis
      5. Mergers & Acquisitions
   2. ASE TECHNOLOGY HOLDING CO. LTD. (CHINA)
      1. Company Overview
      2. Key Executives
      3. Company Snapshot
      4. Role of the Company in the Market
      5. Sustainability and Social Responsibility
      6. Operating Business Segments
      7. Product Portfolio
      8. Business Performance (Production Volume, Sales Volume, Sales Margin, Production Capacity, Capacity Utilization Rate)
      9. Key Strategic Moves And Recent Developments
      10. SWOT Analysis
   3. AMKOR TECHNOLOGY (UNITED STATES)
   4. WALTON ADVANCED ENGINEERING INC. (CHINA)
   5. STATS CHIPPAC (SINGAPORE)
   6. UNISEM GROUP (MALAYSIA)
   7. SILICONWARE PRECISION INDUSTRIES (SPIL) (CHINA)
   8. POWERTECH TECHNOLOGY INC. (CHINA)
   9. TONGFU MICROELECTRONICS CO. LTD. (CHINA)
   10. TIANSHUI HUATIAN TECHNOLOGY CO. LTD (CHINA)
   11. UTAC HOLDINGS LTD (SINGAPORE)
   12. NANTONG FUJITSU MICROELE (CHINA)
   13. KING YUAN ELECTRONICS CO. (CHINA)
   14. CHIPMOS TECHNOLOGIES INC. (CHINA)
   15. HANA MICRON (SOUTH KOREA)
   16. ASE GROUP (TAIWAN)
   17. POWERTECH TECHNOLOGY INC. (TAIWAN)
   18. CHIPMOS TECHNOLOGIES (TAIWAN)
   19. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. (CHINA)
   20. CHIPBOND TECHNOLOGY CORPORATION (TAIWAN)
   21. GLOBAL FOUNDRIES INC. (UNITED STATES)
   22. CORWIL TECHNOLOGY CORP. (ISRAEL)
   23. THINKLOGICAL (BELDEN INC.) (UNITED STATES)
   24. TRIPP LITE (UNITED STATES)
   25. HIDENSITY GROUP (SWITZERLAND)
   26. SIFIVE, INC. (UNITED STATES)
10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY REGION
    1. OVERVIEW
    2. NORTH AMERICA
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Service Type
       4. Historic And Forecasted Market Size By Packaging Type
       5. Historic And Forecasted Market Size By Application
       6. Historic And Forecasted Market Size By Country
          1. USA
          2. Canada
          3. Mexico
    3. EASTERN EUROPE
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Russia
          2. Bulgaria
          3. The Czech Republic
          4. Hungary
          5. Poland
          6. Romania
          7. Rest Of Eastern Europe
    4. WESTERN EUROPE
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Germany
          2. United Kingdom
          3. France
          4. The Netherlands
          5. Italy
          6. Spain
          7. Rest Of Western Europe
    5. ASIA PACIFIC
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. China
          2. India
          3. Japan
          4. South Korea
          5. Malaysia
          6. Thailand
          7. Vietnam
          8. The Philippines
          9. Australia
          10. New-Zealand
          11. Rest Of APAC
    6. MIDDLE EAST & AFRICA
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Turkey
          2. Bahrain
          3. Kuwait
          4. Saudi Arabia
          5. Qatar
          6. UAE
          7. Israel
          8. South Africa
    7. SOUTH AMERICA
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Brazil
          2. Argentina
          3. Rest of South America
11. INVESTMENT ANALYSIS
12. ANALYST VIEWPOINT AND CONCLUSION
    1. Recommendations and Concluding Analysis
    2. Potential Market Strategies
       1. 1. Thailand
          2. Vietnam
          3. The Philippines
          4. Australia
          5. New-Zealand
          6. Rest Of APAC
    3. MIDDLE EAST & AFRICA
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Turkey
          2. Bahrain
          3. Kuwait
          4. Saudi Arabia
          5. Qatar
          6. UAE
          7. Israel
          8. South Africa
    4. SOUTH AMERICA
       1. Key Market Trends, Growth Factors And Opportunities
       2. Key Manufacturers
       3. Historic And Forecasted Market Size By Segments
       4. Historic And Forecasted Market Size By Country
          1. Brazil
          2. Argentina
          3. Rest of South America
13. INVESTMENT ANALYSIS
14. ANALYST VIEWPOINT AND CONCLUSION
    1. Recommendations and Concluding Analysis
    2. Potential Market Strategies

LIST OF TABLES

TABLE 001. EXECUTIVE SUMMARY
TABLE 002. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BARGAINING POWER OF SUPPLIERS
TABLE 003. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BARGAINING POWER OF CUSTOMERS
TABLE 004. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET COMPETITIVE RIVALRY
TABLE 005. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET THREAT OF NEW ENTRANTS
TABLE 006. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET THREAT OF SUBSTITUTES
TABLE 007. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY SERVICE TYPE
TABLE 008. PACKAGING MARKET OVERVIEW (2016-2028)
TABLE 009. TESTING MARKET OVERVIEW (2016-2028)
TABLE 010. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY PACKAGING TYPE
TABLE 011. BALL GRID ARRAY MARKET OVERVIEW (2016-2028)
TABLE 012. CHIP SCALE PACKAGING (CSP) MARKET OVERVIEW (2016-2028)
TABLE 013. MULTI-CHIP PACKAGING (MCP) MARKET OVERVIEW (2016-2028)
TABLE 014. STACKED DIE PACKAGING MARKET OVERVIEW (2016-2028)
TABLE 015. QUAD AND DUAL PACKAGING MARKET OVERVIEW (2016-2028)
TABLE 016. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET BY APPLICATION
TABLE 017. AUTOMOTIVE MARKET OVERVIEW (2016-2028)
TABLE 018. COMMUNICATION MARKET OVERVIEW (2016-2028)
TABLE 019. CONSUMER ELECTRONICS MARKET OVERVIEW (2016-2028)
TABLE 020. COMPUTING & NETWORKING MARKET OVERVIEW (2016-2028)
TABLE 021. INDUSTRIAL MARKET OVERVIEW (2016-2028)
TABLE 022. AEROSPACE & DEFENSE MARKET OVERVIEW (2016-2028)
TABLE 023. OTHERS MARKET OVERVIEW (2016-2028)
TABLE 024. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY SERVICE TYPE (2016-2028)
TABLE 025. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY PACKAGING TYPE (2016-2028)
TABLE 026. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY APPLICATION (2016-2028)
TABLE 027. N OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY COUNTRY (2016-2028)
TABLE 028. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY SERVICE TYPE (2016-2028)
TABLE 029. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY PACKAGING TYPE (2016-2028)
TABLE 030. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY APPLICATION (2016-2028)
TABLE 031. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY COUNTRY (2016-2028)
TABLE 032. ASIA PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY SERVICE TYPE (2016-2028)
TABLE 033. ASIA PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY PACKAGING TYPE (2016-2028)
TABLE 034. ASIA PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY APPLICATION (2016-2028)
TABLE 035. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY COUNTRY (2016-2028)
TABLE 036. MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY SERVICE TYPE (2016-2028)
TABLE 037. MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY PACKAGING TYPE (2016-2028)
TABLE 038. MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY APPLICATION (2016-2028)
TABLE 039. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY COUNTRY (2016-2028)
TABLE 040. SOUTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY SERVICE TYPE (2016-2028)
TABLE 041. SOUTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY PACKAGING TYPE (2016-2028)
TABLE 042. SOUTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY APPLICATION (2016-2028)
TABLE 043. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET, BY COUNTRY (2016-2028)
TABLE 044. ASE TECHNOLOGY HOLDING CO. LTD (CHINA): SNAPSHOT
TABLE 045. ASE TECHNOLOGY HOLDING CO. LTD (CHINA): BUSINESS PERFORMANCE
TABLE 046. ASE TECHNOLOGY HOLDING CO. LTD (CHINA): PRODUCT PORTFOLIO
TABLE 047. ASE TECHNOLOGY HOLDING CO. LTD (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 047. AMKOR TECHNOLOGY (US): SNAPSHOT
TABLE 048. AMKOR TECHNOLOGY (US): BUSINESS PERFORMANCE
TABLE 049. AMKOR TECHNOLOGY (US): PRODUCT PORTFOLIO
TABLE 050. AMKOR TECHNOLOGY (US): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 050. WALTON ADVANCED ENGINEERING INC. (CHINA): SNAPSHOT
TABLE 051. WALTON ADVANCED ENGINEERING INC. (CHINA): BUSINESS PERFORMANCE
TABLE 052. WALTON ADVANCED ENGINEERING INC. (CHINA): PRODUCT PORTFOLIO
TABLE 053. WALTON ADVANCED ENGINEERING INC. (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 053. STATS CHIPPAC (SINGAPORE): SNAPSHOT
TABLE 054. STATS CHIPPAC (SINGAPORE): BUSINESS PERFORMANCE
TABLE 055. STATS CHIPPAC (SINGAPORE): PRODUCT PORTFOLIO
TABLE 056. STATS CHIPPAC (SINGAPORE): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 056. UNISEM GROUP (MALAYSIA): SNAPSHOT
TABLE 057. UNISEM GROUP (MALAYSIA): BUSINESS PERFORMANCE
TABLE 058. UNISEM GROUP (MALAYSIA): PRODUCT PORTFOLIO
TABLE 059. UNISEM GROUP (MALAYSIA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 059. SILICONWARE PRECISION INDUSTRIES (SPIL) (CHINA): SNAPSHOT
TABLE 060. SILICONWARE PRECISION INDUSTRIES (SPIL) (CHINA): BUSINESS PERFORMANCE
TABLE 061. SILICONWARE PRECISION INDUSTRIES (SPIL) (CHINA): PRODUCT PORTFOLIO
TABLE 062. SILICONWARE PRECISION INDUSTRIES (SPIL) (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 062. POWERTECH TECHNOLOGY INC. (CHINA): SNAPSHOT
TABLE 063. POWERTECH TECHNOLOGY INC. (CHINA): BUSINESS PERFORMANCE
TABLE 064. POWERTECH TECHNOLOGY INC. (CHINA): PRODUCT PORTFOLIO
TABLE 065. POWERTECH TECHNOLOGY INC. (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 065. TONGFU MICROELECTRONICS CO. LTD. (CHINA): SNAPSHOT
TABLE 066. TONGFU MICROELECTRONICS CO. LTD. (CHINA): BUSINESS PERFORMANCE
TABLE 067. TONGFU MICROELECTRONICS CO. LTD. (CHINA): PRODUCT PORTFOLIO
TABLE 068. TONGFU MICROELECTRONICS CO. LTD. (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 068. TIANSHUI HUATIAN TECHNOLOGY CO. LTD (CHINA): SNAPSHOT
TABLE 069. TIANSHUI HUATIAN TECHNOLOGY CO. LTD (CHINA): BUSINESS PERFORMANCE
TABLE 070. TIANSHUI HUATIAN TECHNOLOGY CO. LTD (CHINA): PRODUCT PORTFOLIO
TABLE 071. TIANSHUI HUATIAN TECHNOLOGY CO. LTD (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 071. UTAC HOLDINGS LTD (SINGAPORE): SNAPSHOT
TABLE 072. UTAC HOLDINGS LTD (SINGAPORE): BUSINESS PERFORMANCE
TABLE 073. UTAC HOLDINGS LTD (SINGAPORE): PRODUCT PORTFOLIO
TABLE 074. UTAC HOLDINGS LTD (SINGAPORE): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 074. NANTONG FUJITSU MICROELE (CHINA): SNAPSHOT
TABLE 075. NANTONG FUJITSU MICROELE (CHINA): BUSINESS PERFORMANCE
TABLE 076. NANTONG FUJITSU MICROELE (CHINA): PRODUCT PORTFOLIO
TABLE 077. NANTONG FUJITSU MICROELE (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 077. KING YUAN ELECTRONICS CO. (CHINA): SNAPSHOT
TABLE 078. KING YUAN ELECTRONICS CO. (CHINA): BUSINESS PERFORMANCE
TABLE 079. KING YUAN ELECTRONICS CO. (CHINA): PRODUCT PORTFOLIO
TABLE 080. KING YUAN ELECTRONICS CO. (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 080. CHIPMOS TECHNOLOGIES INC. (CHINA): SNAPSHOT
TABLE 081. CHIPMOS TECHNOLOGIES INC. (CHINA): BUSINESS PERFORMANCE
TABLE 082. CHIPMOS TECHNOLOGIES INC. (CHINA): PRODUCT PORTFOLIO
TABLE 083. CHIPMOS TECHNOLOGIES INC. (CHINA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 083. HANA MICRON (SOUTH KOREA): SNAPSHOT
TABLE 084. HANA MICRON (SOUTH KOREA): BUSINESS PERFORMANCE
TABLE 085. HANA MICRON (SOUTH KOREA): PRODUCT PORTFOLIO
TABLE 086. HANA MICRON (SOUTH KOREA): KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 086. OTHER MAJOR PLAYERS: SNAPSHOT
TABLE 087. OTHER MAJOR PLAYERS: BUSINESS PERFORMANCE
TABLE 088. OTHER MAJOR PLAYERS: PRODUCT PORTFOLIO
TABLE 089. OTHER MAJOR PLAYERS: KEY STRATEGIC MOVES AND DEVELOPMENTS

LIST OF FIGURES

FIGURE 001. YEARS CONSIDERED FOR ANALYSIS
FIGURE 002. SCOPE OF THE STUDY
FIGURE 003. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY REGIONS
FIGURE 004. PORTER'S FIVE FORCES ANALYSIS
FIGURE 005. BARGAINING POWER OF SUPPLIERS
FIGURE 006. COMPETITIVE RIVALRYFIGURE 007. THREAT OF NEW ENTRANTS
FIGURE 008. THREAT OF SUBSTITUTES
FIGURE 009. VALUE CHAIN ANALYSIS
FIGURE 010. PESTLE ANALYSIS
FIGURE 011. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY SERVICE TYPE
FIGURE 012. PACKAGING MARKET OVERVIEW (2016-2028)
FIGURE 013. TESTING MARKET OVERVIEW (2016-2028)
FIGURE 014. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY PACKAGING TYPE
FIGURE 015. BALL GRID ARRAY MARKET OVERVIEW (2016-2028)
FIGURE 016. CHIP SCALE PACKAGING (CSP) MARKET OVERVIEW (2016-2028)
FIGURE 017. MULTI-CHIP PACKAGING (MCP) MARKET OVERVIEW (2016-2028)
FIGURE 018. STACKED DIE PACKAGING MARKET OVERVIEW (2016-2028)
FIGURE 019. QUAD AND DUAL PACKAGING MARKET OVERVIEW (2016-2028)
FIGURE 020. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY APPLICATION
FIGURE 021. AUTOMOTIVE MARKET OVERVIEW (2016-2028)
FIGURE 022. COMMUNICATION MARKET OVERVIEW (2016-2028)
FIGURE 023. CONSUMER ELECTRONICS MARKET OVERVIEW (2016-2028)
FIGURE 024. COMPUTING & NETWORKING MARKET OVERVIEW (2016-2028)
FIGURE 025. INDUSTRIAL MARKET OVERVIEW (2016-2028)
FIGURE 026. AEROSPACE & DEFENSE MARKET OVERVIEW (2016-2028)
FIGURE 027. OTHERS MARKET OVERVIEW (2016-2028)
FIGURE 028. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY COUNTRY (2016-2028)
FIGURE 029. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY COUNTRY (2016-2028)
FIGURE 030. ASIA PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY COUNTRY (2016-2028)
FIGURE 031. MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY COUNTRY (2016-2028)
FIGURE 032. SOUTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES MARKET OVERVIEW BY COUNTRY (2016-2028)