Semiconductor Bonding Market - Latest Advancement And Analysis

Global Semiconductor Bonding Market Overview

The Global Semiconductor Bonding Market size is expected to grow from USD 1283.06 million in 2024 to USD 1783.15 million by 2032, at a CAGR of 4.2% during the forecast period (2025-2032).

Semiconductors encompass atoms bonded collectively to shape a homogeneous shape. In the bonding model, the shape of the cloth is homogeneous and truly comparable throughout. Semiconductor bonding is used within the making of numerous incorporated circuits and fabrication devices. The increase in complexity of semiconductor IC designs, growth withinside the want for semiconductor ICs which can carry out a couple of capabilities is major drives the marketplace at some point of the forecast period. Semiconductor Bonding Equipment is used for an incorporated chip to function, it wishes to be linked to the package deal or immediately to the broadcast circuit. This entails twine bonding, die-bonding, and dicing. Also, it's far a back-give-up system of chip formation. Increased usage of IoT devices and automated automotive components push the growth of the semiconductor bonding market.

Market Dynamics and Factors of Semiconductor Bonding:

Drivers

The growing adoption of stacked die generation in IoT equipment is using the increase of the semiconductor bonding market. Stacked die refers to attaching one naked die on the pinnacle of every different inside an unmarried semiconductor package; it's far used to make use of the identical placement region on a substrate for more than one functionality. Die stacking ends in the higher electric overall performance of equipment, because the shorter routing of interconnections among circuits affects quicker sign generation. Original device manufacturers withinside the semiconductor enterprise is specializing in leveraging the blessings of IoT past connectivity. IoT equipment and technology together with sensors, RFID tags, clever meters, clever beacons, and distribution manipulate structures are more and more being deployed in packages together with constructing and domestic automation, clever manufacturing, linked logistics, clever retail, clever mobility, and transportation, etc. Semiconductor bonding strategies are utilized in IoT equipment to connect multi-stacked dies on substrates with the use of minimal space.

Increased technological advancement AI in the automotive sector would contribute significantly toward the growth of the semiconductor bonding market. The increasing demand for vehicle connectivity would encourage new developments in the industry. With ongoing trends such as touch-free human-machine interfaces revolutionizing the automotive sector, there is a growing significance of connected cars. Newly developed methods in semiconductor bonding for specific segments like the automotive sector creating a boom in the semiconductor bonding market.

Restraints

Semiconductor bonding equipment is state-of-the-art machines that require excessive enter electricity to carry out die connect operations. The electricity that ate up with the aid of using this equipment varies from masses to heaps of watts. The production fee of semiconductor bonding equipment is likewise very excessive because of the implementation of complicated steeply-priced components. The meeting of various huge and small parts, which include screen, bonding hand, vacuum, sensors, and the warmth source, is likewise costly. Thus, the general manufacturing and possession expenses of semiconductor bonding equipment for die bonder equipment are distinctly excessive. Additionally, the exorbitant fee of semiconductor wafers will increase the working fee of the semiconductor bonding, thereby hindering the market’s growth.

Opportunities

The developing call for skinny wafers withinside the semiconductor enterprise is the main motive for the boom of the wafer bonding market. The improvements in skinny wafers have helped conquer many conventional fabrication processes. With advantages which include ultra-low electricity intake and ultra-excessive electric overall performance, the skinny wafer enterprise is attracting Chinese IC producers trying to leverage this technology. At present, the want for skinny chips for excessive overall performance at a low running voltage and coffee price is the principal reason for many IC providers in China. Therefore, skinny wafer technologies, such as wafer bonding, are gaining a reputation amongst Chinese IC producers which include Hisilicon Technologies, Co Ltd, Spreadtrum Communications, and RDA Microelectronics.

Challenges

Die bonder equipment uses mechanical moves to choose and locate the die for the bonding manner. The equipment has many shifting elements that require particular motion to correctly connect the die to the substrate. However, sometimes the shifting elements can vibrate because of numerous troubles, which include instability and extraordinary motion of mechanical joints. The vibration in die bonders can bring about misplacement or cracking of the die. The vibration of mechanical elements has to turn out to be a first-rate project for semiconductor bonding equipment manufacturers that desires to be overcome.

Thin wafers are risky and liable to harm from stress or stress. A skinny wafer is incredibly bendy and faces breakage troubles even because of little stress or stress. Dies crafted from skinny wafers can ruin effortlessly throughout the inner manner of wafer thinning. Companies running withinside the marketplace are operating towards overcoming this project through growing aid structures to address a skinny wafer thru numerous processes, which includes wafer bonding and debonding. Also, agencies are the use a super adhesive in companies that cope with skinny wafers.

Market Segmentation

By Type, Wafer Bonding is dominating in the type segment of the Semiconductor bonding market. Currently growth in the application of wafer bonding in silicon-on-insulator (SOI) devices, silicon-primarily based sensors and actuators as well as in optical devices. The wafer bonding technology allows various advantages such as prevention of surface bubbles, bonding of various compounds, enables low-temperature bonding, high vacuum bonding, and thinning method for the smart cut procedure. Wafer bonding allows a certain freedom in designing and fabrication in material combination which certainly creates a major factor for the growth of the Semiconductor bonding market globally.  

By Process Type, Die Wafer bonding is dominating in Semiconductor Bonding Market. Die to Wafer bonding is a permitting procedure to boost up the deployment of 3D/heterogeneous integration and result in new generations of equipment with excessive bandwidth, excessive-performance, and coffee energy consumption. While the infrastructure for Die to Wafer bonding remains evolving, new procedure answers and collaborations throughout the delivery chain are at the upward thrust and could play a critical position in growing the best-recognized techniques of Die to Wafer bonding.

By Application, LED is the dominating un application segment of the Semiconductor bonding market. Currently, usage of LED has significantly grown in the past five years due to the penetration of LED in sectors like consumer electronics, automobile, commercial and residential. A variety of benefits of LED lights such as energy efficiency, lower heat emission, and long-lasting quality have pushed the LED lighting application in commercial and industrial lightings. Thin wafer use in LED lighting and equipment provides high energy efficiency with lower power consumption. Thus, the LED segment is expected to be dominating during the forecasted period.

Players Covered in Semiconductor Bonding market are :

• ASM Pacific Technology Ltd.
• Kulicke & Soffa Industries, Inc.
• Besi (BE Semiconductor Industries N.V.)
• Shinkawa Ltd.
• TOWA Corporation
• Palomar Technologies
• F&K Delvotec Bondtechnik GmbH
• KAIJO Corporation
• Hesse GmbH
• Panasonic Corporation
• DIAS Automation (M) Sdn. Bhd.
• MRSI Systems (Mycronic)
• West-Bond, Inc.
• SHIBAURA MECHATRONICS CORPORATION
• Toray Engineering Co., Ltd.
• SET Corporation SA (Smart Equipment Technology)
• MECHATRONIKA
• Mitsubishi Heavy Industries, Ltd.
• TPT Wire Bonder
• FiconTEC Service GmbH, other active players

Regional Analysis of Semiconductor Bonding Market

• APAC is expected to be dominating region register the highest market share in the overall semiconductor bonding market during the forecast period. A large number of Outsourced Semiconductor Assembly and Test players present across the world have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor fabrication process. The growing number of IDMs in the region is anticipated to boost the semiconductor bonding market growth during the forecasted period. The rising production of consumer electronic products such as smartphones, wearables in China and Taiwan is also likely to accelerate the market’s growth in APAC.

Key Developments of Semiconductor Bonding Market

• In July 2024, BE Semiconductor Industries N.V. (the “Company” or “Besi”) (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, announced today that it has successfully priced an offering of €350 million aggregate principal number of Senior Notes due 2031 (the “Notes”). The Notes are priced at par and have a coupon of 4.500% per annum. The closing of the sale of the Notes is scheduled to be completed, and the Notes are expected to be issued, subject to the satisfaction of customary closing conditions.

Covid19 Impact on Semiconductor Bonding Market

The increasing of Covid19 cases and overwhelming response in the healthcare sector caused a large demand for essential medical and general equipment in hospitals and healthcare units. This has pushed the call for power LED lighting fixtures technology in healthcare centers which ultimately reflected on the demand for semiconductor bonding equipment. LED is expected to be the fastest-developing utility phase of the semiconductor bonding marketplace during the forecasted period. This phase has witnessed a decreased effect as compared with different segments, because of the developing penetration of LEDs in numerous sectors, together with purchaser electronics, automotive, industrial, residential, and architectural. LEDs are broadly utilized in industrial and commercial spaces, as LED lighting fixtures give diverse benefits, which include power performance, decrease warmth emission, cost-effectiveness, and nanosecond switching capability. The use of skinny wafers in LED equipment gives diverse benefits, together with excessive performance and coffee strength consumption. The growing call for LED additives withinside the healthcare zone propelled the marketplace increase after the COVID-19 pandemic.